Everbuild Mitre Fast Bonding Industrial Kit

Everbuild Mitre Fast Bonding Industrial Kit

• Bonds most surfaces within 10 seconds, cutting down dramatically mitre assembly bonding times when compared to conventional wood adhesives.


• High viscosity adhesive – Reducing absorption compared to conventional cyanoacrylates on porous surfaces (eg wood)


• Gap filling – high viscosity adhesive will fill small gaps in joints (up to 0.2 mm)


• Mitre Fast Activator Chemical Base N,N-DIMETHYL-PARA-TOLUIDINE


• Appearance Colourless


• Propellant Liquified hydrocarbon


• Mitre Fast Adhesive Base Monomeric Ethyl cyanoacrylate


• Solids 100 % active


• Thermal Condonductivity 0.2 w/k.m


• Gap Filling Capability Up to 0.2 mm


• Refractive Index 1.45 (Cured adhesive)


• Dielectric Strength 11-13 kV/mm


• Dielectric Constant 5.2 @ 1MHz (cured adhesive)


• Softening Point 165 oC


• Working Temps -20 to +80 oC