Everbuild Mitre Fast Bonding Industrial Kit

• Bonds most surfaces within 10 seconds, cutting down dramatically mitre assembly bonding times when compared to conventional wood adhesives.
• High viscosity adhesive – Reducing absorption compared to conventional cyanoacrylates on porous surfaces (eg wood)
• Gap filling – high viscosity adhesive will fill small gaps in joints (up to 0.2 mm)

Mitre Fast Activator Chemical Base N,N-DIMETHYL-PARA-TOLUIDINE
Appearance Colourless
Propellant Liquified hydrocarbon
Mitre Fast Adhesive Base Monomeric Ethyl cyanoacrylate
Solids 100 % active
Thermal Condonductivity 0.2 w/k.m
Gap Filling Capability Up to 0.2 mm
Refractive Index 1.45 (Cured adhesive)
Dielectric Strength 11-13 kV/mm
Dielectric Constant 5.2 @ 1MHz (cured adhesive)
Softening Point 165 oC
Working Temps -20 to +80 oC